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Wafer Packing and unpacking

Wafer Packing and unpacking

  • Tabletop unit
  • Inserts Separator Automatically.
  • Removes Separator Automatically.
  • Automatically Senses Wafer or Separator Presence, will identify multiple.
  • Over 250 Wafer/Hour Throughput Pack or Unpack!
  • Backside Wafer Contact.
  • Programmable Load Options
  • Works with Conductive and Non-Conductive Separators.

Allows Operators to Perform other Tasks during  Operation